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材料成型及控制工程论文，论文编号:JX1393 论文字数:9073.页数:28
摘 要
本文提出片式多层陶瓷电容器（MLCC）在计算机、移动通讯、家用电器等领域得到广泛应用。随着MLCC市场需求的不断扩大，陶瓷电容器技术的革新也在不断进行之中。近几年来，MLCC技术的发展主要集中在产品的高容量化、高压化、贱金属化、小型化及多功能化等方面。
对现代MLCC的要求，就是在降低成本的条件下，在有限的空间之内以陶瓷为介质制作高比容的电容器。本文在MLCC的设计基础上，通过优化流延工艺改善陶瓷膜片性能、在印刷中采用合适的内电极烘干温度、叠层后采用合适的干燥工艺、合理的排胶烧结制度以及电镀工艺提高片式多层陶瓷电容器的电学性能。由于绝缘电阻在片式多层陶瓷电容器的电学性能中比较有代表性，因而，本课题重点研究制备工艺对片式多层陶瓷电容器绝缘电阻的影响规律，主要研究流延工艺、印刷、干燥、排胶、烧结，以及电镀等工艺对绝缘电阻的影响。结果发现，优化流延工艺改善陶瓷膜片性能、在印刷中采用合适的内电极烘干温度、叠层后采用合适的干燥工艺、合理的排胶烧结制度以及电镀工艺均能有效提高微波MLCC的绝缘电阻。
关键词：片式多层陶瓷电容器 MLCC 流延 排胶 烧结 电镀
ABSTRACT
This paper presents chip multi-layer ceramic capacitors (MLCC) are widely used in computers, mobile telecommunications, household appliances, and other fields. MLCC With the continuous expansion of market demand, the ceramic capacitor technology innovation are continuously under way. In recent years, MLCC technology focused on the development of products, high-capacity, high-pressure, base metals, and function of small, and so on.
The requirements of modern MLCC, is to reduce costs under the conditions of the limited space within the medium to produce ceramic capacitors high hematocrit. In this paper, MLCC on the basis of the design, by optimizing the flow extension of ceramic membrane technology to improve performance, used in printing the appropriate electrodes in the drying temperature, the appropriate use of laminated after the drying process, a reasonable row of plastic sintering system and electroplating process to improve Chip multi-layer ceramic capacitors of the electrical properties. As insulation resistance in the chip multi-layer ceramic capacitors in the electrical properties of a more representative and thus, the issue focused on the preparation of multi-layer ceramic capacitors chip insulation resistance of the impact, the major research-extension process, printing, drying , Pai plastic, sintering, and electroplating process, such as the impact of the insulation resistance. The results showed that optimize the flow extension of ceramic membrane technology to improve performance, used in printing the appropriate electrodes in the drying temperature, the appropriate use of laminated after the drying process, a reasonable row of plastic sintering system and electroplating process can effectively improve the microwave MLCC Insulation resistance.
Keywords：Chip multi-layer ceramic capacitors, MLCC, Tape-ranked ,sintered, plastic ,plating
目 录
中文摘要 i
英文摘要 ii
目录 iii
第一章 概述 1
1.1 陶瓷介质电容器 1
1.2 片式多层陶瓷电容器的主要特点与作用 2
1.2.1 片式多层陶瓷电容器的主要特点 2
1.2.2 片式多层陶瓷电容器的主要作用（用途） 4
1.3 片式多层陶瓷电容器的结构与制备工艺 4
1.3.1 片式多层陶瓷电容器的主要特点 4
1.3.2 片式多层陶瓷电容器的等效电路图 5
1.3.3 片式多层陶瓷电容器的制备工艺 6
1.4 片式多层陶瓷电容器的研究现状 7
1.5 立题依据与研究内容 8
第二章 实验与测试过程 10
2.1 片式多层陶瓷电容器的制备过程 10
2.2 片式多层陶瓷电容器的结构设计 10
2.3 工艺因素对片式多层陶瓷电容器绝缘电阻的影响 11
2.4 片式多层陶瓷电容器的测试 11
第三章 制备工艺对绝缘电阻的影响 14
3.1 流延工艺与陶瓷膜片对绝缘电阻的影响 14
3.2 印刷与叠层工艺对绝缘电阻的影响 15
3.3 干燥工艺对绝缘电阻的影响 17
3.4 排胶制度对绝缘电阻的影响 18
3.5 烧结制度对绝缘电阻的影响 19
3.6 电镀工艺对绝缘电阻的影响 19
3.7 本章小 结 20
第四章 结论 22
参考文献 23
致谢 24
